Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging

As a member of the Machine Learning Acceleration team you'll be responsible for the design and optimization of hardware in our data centers.

You'll provide leadership in the application of new technologies - Bachelor's degree in mechanical engineering or equivalent - 5+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design - 3+ years industry experience in advanced packaging of semiconductors - Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials - Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals - Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization - Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software