Sr. Mechanical Engineer, Annapurna Labs, Artificial Intelligence Hardware

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation.

Customers choose us to create cloud solutions that solve challenges that were unimaginable a short - BS degree in mechanical engineering or equivalent - 7+ years industry experience in Mechanical and Thermal design in electronics packaging - Experience in thermal and performance measurements and characterization on SoCs, Servers, or related Systems - 3+ years of experience in SoC Thermal modelling and IC package transient thermal response - Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems - Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging - Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies - Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams