Chiplet Physical Design Engineer

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors.

Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems.

We are growing our team and looking for contributors of all seniorities. As a Senior Chiplet Physical Design Engineer at Tenstorrent , you will work on a high-profile, cutting-edge program designing and integrating multiple chiplets into a System-in-Package (SiP).

You’ll collaborate closely with Tenstorrent experts and leaders across the USA, Japan, and other global sites, as well as external partners, to deliver world-class CPU and AI silicon.

In this role, you will own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes. This role isremote, based out of The United States. We welcome candidates at various experience levels for this role.

During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

An experienced physical design engineer with at least 10 years of relevant experience, who thrives in complex, multi-stakeholder projects. Detail-driven, with a strong sense of ownership from synthesis through design closure. Comfortable working at advanced nodes (3nm and below) and multi-GHz designs.

A collaborative team player who enjoys mentoring others and influencing methodology. Clear communicator who can balance technical depth with schedule and resource constraints. What We Need