IN_RBAI_SMT Process Engineer_IN

SMT Process programming and optimization  1.Develop, create, validate, and release machine programs for Solder Paste Printing (SPP), SPI, Pick & Place, Reflow Oven, and AOI. 2.Optimize stencil, printing, placement, thermal profile, and inspection parameters to achieve process capability targets. 3.Analyze and reduce cycle time, changeover time, and setup losses through continuous improvement initiatives. 4.Standardize program creation and validation processes across all SMT equipment  Process Ownership & Standardization 1.Define, implement, and maintain SOPs, work instructions, control plans, and process standards for SMT operations 2.Establish control limits for paste height, volume, offset, placement accuracy, oven profile, and AOI criteria 3.Monitor process compliance through periodic audits and process confirmations. 4.Review and update process documentation based on lessons learned and engineering changes Quality & Defect reduction  1.Monitor and improve solder paste deposition quality through SPI data analysis. 2.Analyze and eliminate SMT defects such as insufficient solder, excess solder, bridging, tombstone, skew, missing components, lifted leads, solder balls, and polarity errors. 3.Validate solder joint quality through AOI and continuous defect trend monitoring 4.Lead 8D, 5 Why, Fishbone, and PFMEA activities to prevent recurrence of quality issues Machine Performance & Productivity  Improvement 1.Monitor SMT equipment utilization, downtime and throughput performance. 2.Drive corrective actions for recurring machine stoppages and process interruptions. 3.Coordinate with maintenance teams for preventive maintenance, calibration, and breakdown reduction. 4.Implement predictive and preventive measures to improve machine reliability. New Product Introduction (NPI) 1.Review Gerber files, BOM, Pick and Place data, stencil d