Job Description
Job Responsibilities: 2.5D/3DIC platform development. New unit module development and devices development. New process verification and qualification. New platform DSM setup Customer engagement and new product verification Capability Solid semiconductor process integration and device characterization skills Semiconductor device physics and analysis skill. Experienced in 2.5D and 3DIC process development are plus. Skill on FMEA, control plan, DOE (design of experiment) and problem solving. Good communication, self-motived and avid learner Qualification At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields. At least 3 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer. Working experience: 2.5D and 3DIC integration and device background are plus. Proficient English oral and writing skill.
