Job Description
Job Responsibilities: - Lead the equipment team of WLP/RDL to work closely with the facility, vendor and process team to install, buy-off and set up the process with benchmark performance within the required timeline. Manage and optimise maintenance of equipment and work closely with PE to secure OEE (overall equipment effectiveness) with stable and quality equipment performance for high-level productivity, together with a cost-effective approach. Set up and update necessary equipment specifications with BKM for operation/training, maintenance, and quality control. Continuous improvement for higher OEE with quality improvement and cost reduction. Responsible for training, motivating and developing the equipment engineering staff and promoting and maintaining interdepartmental harmony. Work closely with ME, PE, and QA to improve manufacturing cycle time and yield improvement. Support PE, NPI, PIE, and R&D to develop new customer products and develop new technology. Other duties as assigned by supervisor. Job Requirements: - Bachelor's Degree or above in mechanical, electronic, automation engineering or equivalent. Over 10 years of working experience in the installation and maintenance of wafer-level package (WLP), and at least 5 years of experience in leading equipment. Understanding the buy-off and maintenance procedure of equipment. Have effective know-how and skillset on equipment troubleshooting and problem-solving. Familiar with equipment of at least 2 major process areas, lithography, dry/wet process, plasma/PVD process, and backend process. Understanding the KPI on equipment engineering.
