Job Description
Role Overview We are seeking a detail-oriented and technically skilled Physical Failure Analysis (PFA) Engineer (or Senior Engineer) to join our team. This role is central to our laboratory operations, focusing on advanced micro-structural analysis and sample preparation to support the semiconductor and electronics industries. Key Responsibilities ● Advanced Analysis: Perform high-precision physical failure analysis using FIB (Focused Ion Beam) , SEM , and EBSD (Electron Backscatter Diffraction) techniques. ● Crystallographic Characterization: Utilize EBSD to analyze grain orientation, texture, and phase identification to support root-cause failure investigations. ● Sample Preparation: Prepare high-quality TEM (Transmission Electron Microscopy) lamella using specialized FIB-related lift-out techniques. ● Reporting: Compile comprehensive analytical reports detailing FIB-SEM, SEM-EDS and EBSD findings for client delivery. ● Standardization: Document and update Standard Operating Procedures (SOPs), training modules, and certification specifications for failure analysis workflows. ● Innovation: Participate in the research and development of new failure analysis techniques and evaluate emerging technologies to maintain lab excellence. ● Shift Operations: Work within a rotational shift system (Quarterly Day/Night shift rotation). Requirements ● Education: Diploma, Bachelor’s Degree, or Master’s Degree in Engineering (Electrical/Electronic, Materials Science, or a related discipline). ● Technical Skills: Hands-on experience with FIB, SEM, and EDX is highly desirable. Prior experience or theoretical knowledge of EBSD analysis and data interpretation is a significant advantage. ● Industry Knowledge: A solid understanding of semiconductor device physics and manufacturing processes. ● Soft Skills: A keen learner with the ability to work independently in a fast-paced laboratory environment. ● Flexibility: Must be able to perform night shift work with flexible working periods. ●
